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 DATA SHEET
ML54051
NAND Flash Memory Controller PRELIMINARY
SECOND EDITION
ISSUE DATE : JAN. 1999
E2Y0002-29-11
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan
Table of Contents 1. FEATURES ........................................................................................................... 2 2. BLOCK DIAGRAM ............................................................................................... 2 3. PIN SPECIFICATIONS ........................................................................................ 3
3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 Host Interface (PCMCIA) .................................................................................... 3 NAND Flash Memory Interface .......................................................................... 4 External SRAM Interface .................................................................................... 5 Extended Bus Interface ...................................................................................... 5 Other Interfaces .................................................................................................. 5 Power Supply ....................................................................................................... 6 Pin Totals ............................................................................................................. 6 Pin Configuration ................................................................................................ 7
4. FUNCTIONS ........................................................................................................ 8 5. SECTOR FORMATTER AND SEQUENCER ....................................................... 9
5.1 Data Formats ....................................................................................................... 9 5.1.1 Data Format Within Sector ........................................................................ 9 5.1.2 Data Format Within Port .......................................................................... 10 5.1.3 Substitute Management Information Format ........................................... 11 5.2 Write Sector Commands .................................................................................. 12 5.2.1 Dual Port Control ..................................................................................... 12 5.2.2 Block Control ........................................................................................... 12 5.3 Substitute Processing (Defect Management) ................................................. 13 5.3.1 Substitute Management Information Format Processing ........................ 13 5.3.1.1 Sector Management .............................................................................. 13 5.3.1.2 Substitute Management Information Management ............................... 14 5.4 Generation of Substitute Management Information ...................................... 14 5.5 Substitute Processing....................................................................................... 15 5.6 Substitute Destination Detection Processing ................................................ 16
6. ATA REGISTERS ............................................................................................... 17
6.1 6.2 6.3 6.4 6.5 6.6 Memory Mapped Configuration ....................................................................... 17 I/O Mapped 16 Contiguous Registers Configuration .................................... 18 Primary I/O Mapped Configuration ................................................................. 18 Secondary I/O Mapped Configuration ............................................................ 19 True IDE Mapped Configuration ...................................................................... 19 ATA Registers .................................................................................................... 20 6.6.1 Data Register (Write/Read) ...................................................................... 20 6.6.2 Error Register (Read Only) ....................................................................... 20 6.6.3 Feature Register (Write Only) ................................................................... 20 6.6.4 Sector Count Register (Write/Read) ........................................................ 20 6.6.5 Sector Number Register (Write/Read) ..................................................... 21 6.6.6 Cylinder Low Register (Write/Read) ......................................................... 21 6.6.7 Cylinder High Register (Write/Read) ........................................................ 21 6.6.8 Drive Head Register (Write/Read) ............................................................ 21 6.6.9 Status Register & Alternate Status Register (Read Only) ........................ 22 6.6.10 Device Control Register (Write Only) ....................................................... 22 6.6.11 Command Register (Write Only) .............................................................. 22
7. PCMCIA INTERFACE ........................................................................................ 23
7.1 7.2 7.3 7.4 7.5 7.6 7.7 ATA Commands (Standard) .............................................................................. 23 Commands for CompactFlash ......................................................................... 24 Vendor-Unique Commands .............................................................................. 24 Card Information Structure .............................................................................. 24 Identify Information ........................................................................................... 24 Number of Installed Memory Chips and CHS Structure................................ 25 Modes ................................................................................................................. 27 7.7.1 Memory Mapped ..................................................................................... 27 7.7.2 I/O Mapped 16 Contiguous Registers ..................................................... 27 7.7.3 Primary I/O Mapped ................................................................................ 27 7.7.4 Secondary I/O Mapped ........................................................................... 27 7.7.5 True IDE ................................................................................................... 27
8. CHIP MODES .................................................................................................... 28
8.1 Types .................................................................................................................. 28 8.2 Settings .............................................................................................................. 28 8.3 Pin Assignment.................................................................................................. 28
9. ELECTRICAL CHARACTERISTICS .................................................................. 29
9.1 Absolute Maximum Ratings ............................................................................. 29 9.2 Recommended Operating Conditions ............................................................. 29 9.3 DC Characteristics ............................................................................................ 29
10. BUS SPECIFICATIONS ..................................................................................... 30
10.1 I/O Mode ........................................................................................................... 30 10.2 Bus Timing Specifications ............................................................................... 30 10.3 Power ON/OFF, Reset, Busy Timing .............................................................. 30
11. PACKAGE DIMENSIONS .................................................................................. 31 12. APPLICATION EXAMPLES ............................................................................... 32
E2F0018-29-13
Semiconductor ML54051
Semiconductor NAND Flash Memory Controller
el im This version: Jan. 1999 ML54051 ina ry Previous version: Oct. 1998
Pr
The ML54051 is a controller that integrates into a single chip a host interface that conforms to PCMCIA, an interface to a buffer used for data transfer, the necessary functions to control NAND memory, and a microcontroller. Internal 256 byte RAM is provided for storage of the card information structure (CIS). Also, 128KB of SRAM may be connected as a buffer for data transfer. A maximum of 16 chips of 64 Mbit or larger NAND flash memory can be controlled when the chip is used as stand-alone. If a decoder circuit is externally added, a maximum of 64 chips can be controlled.
CompactFlashTM is a trademark of SanDisk Corporation.
1/33
Semiconductor
ML54051
1. FEATURES
* Single chip controller with internal microcontroller (min. 4 cycles/instruction execution) * Operating voltage: 3.3 V, Interface voltage: 3.3 V/5 V * Internal 256B RAM for card information structure (CIS) storage * Conforms to PC card standard - PC card ATA specification * Auto-sleep mode support * True IDE Mode support * ECC system by BCH code (3-bit random error correction is possible for user data and ECC data) * Substitute control function (defect management function) * Debug mode support * External buffer (128KB SRAM) control is possible * High-speed operation via dual port bus control * Low power consumption due to single chip controller * Control of multiple NAND flash memories (64MB to 512MB) is possible Chip stand-alone : 16 pcs max. Chip and external decoder circuit : 64 pcs max. * 144-pin LQFP package (LQFP144-P-2020-0.50-K)
2. BLOCK DIAGRAM
External CPU Bus PCMCIA I/F Host I/F PCMCIA ATA
ROM
RAM NAND Flash Bus
Media I/F MPU
CIS
ECC
RAM Arbiter
External SRAM
2/33
Semiconductor
ML54051
3. PIN SPECIFICATIONS
Refer to Section 12, "Application Examples" for specific connection examples. 3.1 Host Interface (PCMCIA)
Signal Name Type ha [10:0] hd [15:0] hcen [2:1] I B I Pin Count 11 16 2 Description Address bus (A10 is MSB, A0 is LSB) Data bus (D15 is MSB, D0 is LSB) Card enable signal (hcen1 controls even addresses and hcen2 controls odd addresses. The combination of ha0, hcen1 and hcen2 allows even/odd addresses to be accessed by hd[7:0].) hiordn hiowrn hoen hwen hregn hirqn hstschgn hinpackn hiois16n hwaitn hspkr hrst hcseln I I I I I O O O O O B I I/(O) 1 1 1 1 1 1 1 1 1 1 1 1 1 Total 42 pins I/O read signal (control signal to read data from ATA registers) I/O write signal (control signal to write data to ATA registers) Output enable signal Write enable signal Register select & I/O Enable signal Interrupt request signal (when the card is configured as an I/O card) Card status change signal (signal to change the status of the configuration status register) Input port acknowledge signal (acknowledge signal during I/O read) 16-bit address enable signal (when the card is configured as an I/O card, this signal indicates that 16-bit addresses are enabled) Wait signal Audio digital waveform signal Reset signal Cable select signal (used only in True IDE Mode, GND: Master, X: Slave)
*
In an external CPU connection mode, hcseln functions as a control signal (xint) for the extended bus. I: Input, O: Output, B: Bidirectional
3/33
Semiconductor 3.2 NAND Flash Memory Interface
Signal Name Type maio [7:0] macle maale maren mawen marbn mbio [7:0] mbcle mbale mbren mbwen mbrbn mctl mcen [7:0] B O O O O I B O O O O I I O Pin Count 8 1 1 1 1 1 8 1 1 1 1 1 1 8 Port A I/O bus Description
ML54051
Port A command latch enable signal (signal to control latching of an operation command into a device) Port A address latch enable signal (signal to control latching of an address or input data into a device) Port A read enable signal Port A write enable signal (signal to latch data into a device) Port A ready/busy signal (signal to check internal status of device) Port B I/O bus Port B command latch enable signal (signal to control latching of an operation command into a device) Port B address latch enable signal (signal to control latching of an address or input data into a device) Port B read enable signal Port B write enable signal (signal to latch data into a device) Port B ready/busy signal (signal to check internal status of device) Chip enable signal mode select (mcen[7:0] control) Chip enable signals mct1 = 0 : Chip enable signal mct1 = 1 : Chip select and chip enable signals
mwpn
O
1 Total 36 pins
Write protect signal (signal to forcibly prohibit write and erase operations)
*
*
mcen[7:0] performs 2 types of operations depending upon the mctl signal. If mctl = 0, mcen[7:0] functions as the chip enable signals. If mctl = 1, mcen[5:1] functions as the chip select signals and mcen[0] functions as the chip enable signal. In the latter case, mcen[5:1] and mcen[0] must be connected to an external decoder and mcen[7:6] are not used. In an external CPU connection mode, mctl and mcen[7:6] function as control signals (xpsen, xrst, xclk, respectively) for the extended bus.
4/33
Semiconductor 3.3 External SRAM Interface
Signal Name Type ra [16:0] rd [7:0] rren rwen rcen O B O O O Pin Count 17 8 1 1 1 Total 28 pins Data bus for external SRAM Read enable signal for external SRAM Write enable signal for external SRAM Chip enable signal for external SRAM Description Address bus for external SRAM
ML54051
3.4 Extended Bus Interface The extended bus interface is a signal line for the ML54051's internal microcontroller. The extended bus interface is used for purposes such as debugging.
Signal Name Type xah [15:8] xad [7:0] xrd xwr xale xpsen xint xrst xclk B B B B B I O O O Pin Count 8 8 1 1 1 (1) (1) (1) (1) Total 19 pins Address bus for extended bus Address/data bus for extended bus Read signal for extended bus Write signal for extended bus Address latch enable signal for extended bus Program store enable signal for extended bus Interrupt signal for extended bus Reset signal for extended bus Clock signal for extended bus Description
*
In an external ROM connection mode, xah, xad, xrd, xwr, and xale are used to connect to external ROM.
3.5 Other Interfaces
Signal Name Type txd/pcfg [0] rxd/pcfg [1] porn xin xout B I I I O Pin Count 1 1 1 1 1 Total 5 pins Power-on-reset signal (connect to power monitor circuit) Clock I/O (connect a crystal oscillator between xin and xout) Description Serial data I/O and chip mode setting
*
The chip mode is determined depending upon the status of pcfg[1:0] when the porn signal rises. pcfg[1:0] = 11 : Normal mode pcfg[1:0] = 01 : External CPU connection mode pcfg[1:0] = 10 : External ROM connection mode pcfg[1:0] = 00 : Test mode (normally not used)
5/33
Semiconductor 3.6 Power Supply
Signal Name Type VDD-CORE VSS-CORE VDD VSS DC DC DC DC Pin Count 2 2 4 6 Total 14 pins Power supply for I/O pad Power supply for core Description
ML54051
3.7 Pin Totals
Host Interface NAND Flash Memory Interface External SRAM Interface Extended Bus Interface Other Interfaces Power Supply Total 42 36 28 19 5 14 144
6/33
Semiconductor 3.8 Pin Configuration
porn mwpn mctl rxd txd ra12 ra13 ra11 ra14 ra10 ra15 ra9 ra16 ra8 rwen rd4 rd3 rd5 VDD-CORE VDD VSS rd2 rd6 rd1 rd7 rd0 rren rcen ra7 ra0 ra6 ra1 ra5 ra2 ra4 ra3
ML54051
macle maale maren mawen marbn VSS xout xin maio0 maio7 maio1 maio6 maio2 maio5 VDD maio3 maio4 mcen0 VSS-CORE mcen1 mcen2 mcen3 mcen4 mcen5 mcen6 mcen7 VSS mbcle mbale mbren mbwen mbrbn mbio0 mbio7 mbio1 mbio6

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109
ML54051
108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73
hd3 hd11 hd4 hd12 hd5 hd13 hd6 VSS hd14 hd7 hd15 hce1n hce2n ha10 hoen hiordn ha9 hiowrn VSS-CORE ha8 hwen ha7 hirqn ha6 hcseln VDD ha5 ha4 hrst ha3 hwaitn ha2 hinpackn ha1 hregn ha0
mbio2 mbio5 mbio3 mbio4 VDD xrdn xale VSS xad7 xad6 xad5 xad4 xad3 xad2 xad1 xad0 xa15 xa14 VDD-CORE xa13 xa12 xa11 xa10 xa9 xa8 xwrn hd10 hiois16n VSS hd9 hd2 hd8 hd1 hstschgn hd0 hspkr
37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72
144-Pin Plastic LQFP
7/33
Semiconductor
ML54051
4. FUNCTIONS
(1) Sector Formatter and Sequencer The sector formatter and sequencer control the logical format of the NAND flash memory and efficiently perform defect management (substitute processing). PCMCIA Interface The PCMCIA interface conforms to PCMCIA-ATA specification. Since True IDE Mode is also supported, the general usefulness of this interface is increased. Chip Modes An external ROM connection mode for the ML54051's internal microcontroller and an external CPU connection mode are supported. With these modes, evaluation can be performed efficiently. Auto-Sleep Mode If there is no access from the host over a specific period of time, operation automatically transfers to the sleep mode. Dual Port Bus Control Mode When erasing data or writing the same data, two port buses (Port A, Port B) can be utilized simultaneously for high-speed operation.
(2)
(3)
(4)
(5)
8/33
Semiconductor
ML54051
5. SECTOR FORMATTER AND SEQUENCER
5.1 Data Formats 5.1.1 Data Format Within Sector
User data, ECC data and Header data are stored at the top of the sector first. ECC data contains the ECC information for user data and ECC data. Since the same flag data is stored in all pages (sectors) within the same block, the validity of flag data of the specified page can be verified by comparing it to the flag data of another page. For this reason, ECC information is not provided for the header data.
512 bytes User Data
10 bytes ECC Data
6 bytes Header Data
8 bits Flag
17 bits Address
23 bits Count
5 bits Column No.
12 bits Substitute Destination Address
Flag ... page (sector) status FFh: Good (normal data storage) F0h: Bad (uncorrectable error, before substitution) 0Fh: Change (substitution completed) Other than above: Null (abnormal)
Address ... block address (supports up to 4096 blocks: 512 Mbits) Column No. : supports up to column number 31 (00h to 1Fh) Substitute destination address: block address within spare area Supports up to 4096 blocks (512 Mbits) Value to be stored in substitute destination address, substitute source address * Normal data = block address * Substitute destination sector = substitute source address * Substitute source sector = substitute destination address Count... number of writes (supports up to 8,388,607 writes) A substitute process is performed to a block that reaches the number of writes previously set.
9/33
Semiconductor 5.1.2 Data Format Within Port
ML54051
Each chip is partitioned into a user area to store user data, a spare area to transfer data in defective sectors, and a substitute management information area to keep sector transfer information. The port views this configuration as a single chip. Substitute processing is performed in block units, not in sector units. If the process is performed in sector units, a single block will have data from various addresses at random, which delays the substitute processing. A substitute management information is made per port; while a copy of substitute management information is reserved as a back-up.
Port A Chip 1 Chip 3 Chip n - 1
User Area
User Area
***
User Area
Spare Area Spare Area Substitute Management Information Area Port B Chip 2 Chip 4 Chip n Spare Area
User Area
User Area
***
User Area
Spare Area Spare Area Substitute Management Information Area Spare Area
10/33
Semiconductor 5.1.3 Substitute Management Information Format
ML54051
The location of management information itself specifies a substitute destination. And an original sector locations is identified by a column number and a block address to be stored in a management information. Please note that a substitute management information cannot be transfered to other chips.
512 bytes 3 bytes Page 1 * * * Page m-1 Page m CIS Information [256 bytes] 3 bytes 3 bytes *** Management Management Info. 1 Info. n Port A Chip 1 Port A Chip 3 *** Management Info. 1 Port A Chip 3 *** 2 bytes Unused 3 bytes D-List Identify Info. D-List Unique Info. Unused * Identify Info. * * * * * * * ECC * * * ECC Unused D-List Unique Info. Identify Info. ECC Header * * * Header Header 3 bytes Unique Info. 10 bytes ECC 6 bytes Header 666666[h] 666666[h] Management D-List D-List Info. n-2 (orig.) (duplicate) Port A Chip 1
Management Info. * * * Identify Information [512 bytes] Unused [248 bytes]
* Management Information (3 bytes) Stores substitute origin information
7 bits Blank 5 bits Column No. 12 bits Address of an original block to be substituted Column No. : 0 to 31
The following values have unique meanings.
55 55 55 [h] 66 66 66 [h] 0F 0F 0F [h] FF FF FF [h] Reconstructed D-List Block Registered Position Spare Block for D-List Use Error Occurred D-List Block/Unusable Spare Block Usable/Unused Spare Block
* D-List Identify Information (3 bytes) Indicates that the sector is valid (fixed values: 4Fh, 4Bh, 49h) * Unique Information (3 bytes) During the low level format, stores total number of chips, chip number, and individual memory type information
1 byte Total No. of Chips 1 byte Chip No. 1 byte Individual Memory Type Info.
Total No. of chips: The number of chips connected to the ML54051 (1 to 64) Chip No. : The chip number that contains the substitute management information (0 or 1) Individual memory type info. : Number of blocks per chip (4 bits) and number of pages per block (4 bits)
Memory Capacity 64 Mbit 128 Mbit 256 Mbit 512 Mbit Number of Blocks Per Chip 1[h] (1024 Block) 2[h] (2048 Block) 4[h] (4096 Block) Number of Pages Per Block 0[h] (16 Page) 1[h] (32 Page)
11/33
Semiconductor 5.2 Write Sector Commands Two methods are reserved for a faster access. 5.2.1 Dual Port Control
ML54051
By controlling Port A and Port B independently, 2 chips can be accessed simultaneously when erasing data or writing the same data, which doubles the access time.
Port A Chip 1 Port B Chip 2 Chip 4 Chip 6
* * *
Chip 3
Chip 5
*
*
*
5.2.2
Block Control
When the host requests a write that includes Block 1 of Port B, if it is unnecessary to save the stored data, a block read will not be performed for the shaded section of the diagram below, which saves read time. This is enabled by making use of NAND flash memory characteristics to erase data in a unit of a block.
Port A
Block 1
Port B
Block 1
Port A
Block 2
12/33
Semiconductor 5.3 Substitute Processing (Defect Management)
ML54051
Substitute processing (defect management) is made through the following four processes in block units. 1. Substitute management information format processing : Information management of defective sector addresses, substitute destination addresses, etc. Substitute management information generation processing : Generates substitute management information for entire card during low level format Substitute processing : Replaces a defective sector with a normal sector
2.
3. 4.
Substitute destination detection : Detects substitute destination of defective sector that was substituted
5.3.1
Substitute Management Information Format Processing
See section 5.1, "Data Formats", for the data formats of defective sector information and transfer destination information to be stored. 5.3.1.1 Sector Management
A header section is read before reading or writing data. A flag of a header section indicates if a sector is normal. (1) User area
Flag FFh 0Fh F0h Other values Read The specified sector is accessed. destination detection processing is accessed. An uncorrectable error (UNC) is returned and processing is aborted. The substitute destination is detected from the substitute management information and the substitute destination is accessed. If the substitute destination cannot be detected, a substitute processing error (DWF) is returned and processing is aborted. Write The specified sector is accessed. destination detection processing is accessed. The substitute destination obtained by substitute processing is accessed. The substitute destination is detected from the substitute management information and the substitute destination is accessed. If the substitute destination cannot be detected, the substitute destination obtained by substitute processing is accessed.
The substitute destination obtained by substitute The substitute destination obtained by substitute
Note:
Because the user area is controlled in block units, the flag values of all sectors are the same within a block.
13/33
Semiconductor (2) Spare area
Flag FFh 0Fh F0h processing is aborted. Other values An uncorrectable error (UNC) is returned and processing is aborted. Read The specified sector is accessed. -- An uncorrectable error (UNC) is returned and Write The specified sector is accessed. --
ML54051
The block is labeled as a BAD block. Substitute processing is performed again to change the substitute destination. The substitute destination is detected from the substitute management information and the substitute destination is accessed. If the substitute destination cannot be detected, the substitute destination obtained by substitute processing is accessed.
Note: (3)
The same flag control is performed in spare areas and user areas. D-List area
Flag FFh Other values
Read The specified sector is accessed. Substitute management information (duplicate) is used as the new substitute management information (original). Substitute management information (duplicate) is written to another block and used as new substitute management information (duplicate). When the Flag of the substitute management information (duplicate) is not equal to FFh, substitute management information is reconstructed.
Write The specified sector is accessed. Substitute management information (duplicate) is used as the new substitute management information (original). Substitute management information (duplicate) is written to another block and used as new substitute management information (duplicate). When the Flag of the substitute management information (duplicate) is not equal to FFh, substitute management information is reconstructed.
5.3.1.2
Substitute Management Information Management
In accordance with section 5.1.3, "Substitute Management Information Format", substitute management information is arranged beginning at the rear of the spare area. If two pieces of substitute management information cannot be read correctly, the substitute source is read from the address of the header section in each sector of a substituted block within the spare area, a substitute management information is reconstructed. 5.4 Generation of Substitute Management Information Substitute management information is generated in all chips. An issue of Low Level Format command as one of the vendor-unique commands initiates a scanning on memories, and defective block locations in spare area and in user area are identified and substitute correspondance is registered as a default setting of a substitute management information.
14/33
Semiconductor 5.5 Substitute Processing
ML54051
When a defective sector is found in a user area, the user area block containing the defective sector will be substituted with another normal block of the spare area.
Substitute processing
Unused block detection within same port
Unused block? Yes
No
Register in substitute management information (original)
Register in substitute management information (duplicate)
Generate and write defective block data
Write to substitute destination of user data
Set error indicating no substitute destination
End
Defective block data: Index to show a block contains a defective sector(s). This index is stored in the header section of a block.
15/33
Semiconductor 5.6 Substitute Destination Detection Processing
ML54051
If the sector accessed in the user area is defective and has already been substituted, the substitute destination is detected.
Substitute destination search
Flag? Value other than 0Fh (excluding FFh) 0Fh This chip? Yes Acquire from header section
UNC error, abort processing
F0h
No
Acquisition OK? Yes
No
Acquire from substitute management information of same port
Yes
Acquisition OK? No
Acquire from header section of substituted block of spare area
Yes
Acquisition OK? No
End
Error end
16/33
Semiconductor
ML54051
6. ATA REGISTERS
When a mode such as memory mode or I/O mode is configured, the host must use different addresses for access. 6.1 Memory Mapped Configuration
-CE1 -CE2 -REG A10 A9-A4 A3-A0 0 0 0 1 0 0 1 0 0 1 0 0 1 0 0 0 1 0 1 0 0 1 0 0 0 1 0 1 1 0 1 1 0 1 1 0 1 1 0 0 1 1 0 1 0 1 1 0 0 1 1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 * * * * * * * * * * * * * * * * * * * * * * * * * * 0h 1h 2h 3h 4h 5h 6h 7h Read (-OE = L) 8-bit Data Error Sector Count Sector Number Cylinder Low Cylinder High Drive/Head Status Write (-WE = L) D15 : D0 16-bit Data D7 : D0 8-bit Data D7 : D0 Features D15 : D8 Features D7 : D0 Sector Count D7 : D0 Sector Number D15 : D8 Sector Number D7 : D0 Cylinder Low D7 : D0 Cylinder High D15 : D8 Cylinder High D7 : D0 Drive/Head D7 : D0 Command D15 : D8 Command D15 : D0 Duplicate Data D7 : D0 Duplicate Even D7 : D0 Duplicate Odd D15 : D8 Duplicate Odd D7 : D0 Duplicate Features D15 : D8 Duplicate Features D7 : D0 Device Control D7 : D0 Not Used D15 : D8 Not Used D15 : D0 16-bit Data D7 : D0 Even Data D7 : D0 Odd Data D15 : D8 Odd Data D15 : D0 D7 : D0 D7 : D0 D15 : D8 D15 : D0 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D15 : D0 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D15 : D8 D7 : D0
(000x) 16-bit Data
(000x) Error
(001x) Sector Number
(010x) Cylinder High
(011x) Status (100x) Duplicate Data 8h 9h Dh Eh Fh * Duplicate Even Duplicate Odd Duplicate Error Alternate Status Drive Address 16-bit Data
(100x) Duplicate Odd (110x) Duplicate Error
(111x) Drive Address (xxx0) Even Data (xxx1) Odd Data * Odd Data * Don't care
17/33
Semiconductor 6.2 I/O Mapped 16 Contiguous Registers Configuration
-CE1 -CE2 -REG A9-A4 A3-A0 0 0 0 1 0 0 1 0 0 1 0 0 1 0 0 0 1 0 1 0 0 1 0 1 1 0 1 1 0 1 1 0 1 1 0 0 1 1 0 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 * * * * * * * * * * * * * * * * * * * * * * 0h 0h 1h 2h 3h 4h 5h 6h 7h 8h 8h 9h Dh Eh Fh 8-bit Data Error Sector Count Sector Number Cylinder Low Cylinder High Drive/Head Status Duplicate Data Duplicate Even Duplicate Odd Duplicate Error Alternate Status Drive Address Read (-IORD = L) 16-bit Data
ML54051
Write (-IOWR = L) D15 : D0 16-bit Data D7 : D0 8-bit Data D7 : D0 Features D15 : D8 Features D7 : D0 Sector Count D7 : D0 Sector Number D15 : D8 Sector Number D7 : D0 Cylinder Low D7 : D0 Cylinder High D15 : D8 Cylinder High D7 : D0 Drive/Head D7 : D0 Command D15 : D8 Command D15 : D0 Duplicate Data D7 : D0 Duplicate Even D7 : D0 Duplicate Odd D15 : D8 Duplicate Odd D7 : D0 Duplicate Features D15 : D8 Duplicate Features D7 : D0 Device Control D7 : D0 Not Used D15 : D8 Not Used D15 : D0 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D15 : D0 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D15 : D8 D7 : D0
(000x) Error
(001x) Sector Number
(010x) Cylinder High
(011x) Status
(100x) Duplicate Odd (110x) Duplicate Error
(111x) Drive Address * Don't care
6.3 Primary I/O Mapped Configuration
-CE1 -CE2 -REG 0 0 0 1 0 0 1 0 0 1 0 0 1 0 0 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 A9-A0 1F0h 1F0h 1F1h 1F0h/1F1h 1F2h 1F3h 1F2h/1F3h 1F4h 1F5h 1F4h/1F5h 1F6h 1F7h 1F6h/1F7h 3F6h 3F7h 3F6h/3F7h Read (-IORD = L) 16-bit Data 8-bit Data Error Error Sector Count Sector Number Sector Number Cylinder Low Cylinder High Cylinder High Drive/Head Status Status Alternate Status Drive Address Drive Address Write (-IOWR = L) D15 : D0 16-bit Data D7 : D0 8-bit Data D7 : D0 Features D15 : D8 Features D7 : D0 Sector Count D7 : D0 Sector Number D15 : D8 Sector Number D7 : D0 Cylinder Low D7 : D0 Cylinder High D15 : D8 Cylinder High D7 : D0 Drive/Head D7 : D0 Command D15 : D8 Command D7 : D0 Device Control D7 : D0 Not Used D15 : D8 Not Used D15 : D0 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0
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Semiconductor 6.4 Secondary I/O Mapped Configuration
-CE1 -CE2 -REG 0 0 0 1 0 0 1 0 0 1 0 0 1 0 0 1 0 1 1 0 1 1 0 1 1 0 1 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 A9-A0 170h 170h 171h 170h/171h 172h 173h 172h/173h 174h 175h 174h/175h 176h 177h 176h/177h 376h 377h 376h/377h 8-bit Data Error Error Sector Count Sector Number Sector Number Cylinder Low Cylinder High Cylinder High Drive/Head Status Status Alternate Status Drive Address Drive Address Read (-IORD = L) 16-bit Data
ML54051
Write (-IOWR = L) D15 : D0 16-bit Data D7 : D0 8-bit Data D7 : D0 Features D15 : D8 Features D7 : D0 Sector Count D7 : D0 Sector Number D15 : D8 Sector Number D7 : D0 Cylinder Low D7 : D0 Cylinder High D15 : D8 Cylinder High D7 : D0 Drive/Head D7 : D0 Command D15 : D8 Command D7 : D0 Device Control D7 : D0 Not Used D15 : D8 Not Used D15 : D0 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0 D7 : D0 D15 : D8 D7 : D0
6.5 True IDE Mapped Configuration * Command Block Register
-CE1 -CE2 -REG A9-A3 A2-A0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 * * * * * * * * * 0h 1h 2h 3h 4h 5h 6h 7h (xxx) Error Sector Count Sector Number Cylinder Low Cylinder High Drive/Head Status Not Used Read (-IORD = L) 16-bit Data D7 : D0 Features D7 : D0 Sector Count D7 : D0 Sector Number D7 : D0 Cylinder Low D7 : D0 Cylinder High D7 : D0 Drive/Head D7 : D0 Command Not Used Write (-IOWR = L) D15 : D0 16-bit Data D15 : D0 D7 : D0 D7 : D0 D7 : D0 D7 : D0 D7 : D0 D7 : D0 D7 : D0
* Don't care
* Control Block Register
-CE1 -CE2 -REG A9-A3 A2-A0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 * * * * * (xxx) (0xx) (10x) 6h 7h Read (-IORD = L) High Impedance High Impedance High Impedance Alternate Status Drive Address Write (-IOWR = L) Not Used Not Used Not Used D17 : D0 Device Control D7 : D0 Not Used D7 : D0
* Don't care
19/33
Semiconductor 6.6 ATA Registers ATA registers realize functions of the PC Card ATA Specifications. 6.6.1 Data Register (Write/Read)
ML54051
This 16-bit or 8-bit register is used in the transfer of data blocks between the internal data buffer and the host. Data can be transferred via consecutive 16-bit or 8-bit accesses to the data register. 6.6.2 Error Register (Read Only)
Additional information regarding the cause of a processing error in the previously executed command is indicated. If the error bit of the status register has been set, the host must examine this register.
D7 BBK D6 UNC D5 0 D4 IDNF D3 0 D2 ABRT D1 0 D0 AMNF
This bit is set when a Bad Block is detected. This bit is set when an Uncorrectable Error is encountered. The requested sector ID is in error or cannot be found. This bit is set if the command has been aborted or when an invalid command has been issued. AMNF : This bit is set in case of a general error. 6.6.3 Feature Register (Write Only)
BBK UNC IDNF ABRT
: : : :
This register is used to write information related to commands.
D7 D6 D5 D4 D3 D2 D1 D0
Feature Bytes
6.6.4
Sector Count Register (Write/Read)
This register is used to specify the number of sectors or address of logical blocks to be processed by a command. By reading this register after a command has been completed, the host can check the number of sectors not processed by the command.
D7 D6 D5 D4 D3 D2 D1 D0
Sector Count
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Semiconductor 6.6.5 Sector Number Register (Write/Read)
ML54051
This register is used to specify the sector number or logical block address where processing by the command will begin. By reading this register after a command has been completed, the host can check the sector number or logical block address processed by the command.
D7 D6 D5 D4 D3 D2 D1 D0
Sector Number/LBA7-LBA0
6.6.6
Cylinder Low Register (Write/Read)
This register is used to specify the lower cylinder number or the logical block address where processing by the command will begin. By reading this register after a command has been completed, the host can check the last lower cylinder number or logical block address that was processed by the command.
D7 D6 D5 D4 D3 D2 D1 D0
Cylinder Low/LBA15-LBA8
6.6.7
Cylinder High Register (Write/Read)
This register is used to specify the upper cylinder number or the logical block address where processing by the command will begin. By reading this register after a command has been completed, the host can check the last upper cylinder number or logical block address that was processed by the command.
D7 D6 D5 D4 D3 D2 D1 D0
Cylinder High/LBA23-LBA16
6.6.8
Drive Head Register (Write/Read)
This register is used to specify the head number or the logical block address where processing by the command will begin. By reading this register after a command has been completed, the host can check the last upper head number or logical block address that was processed by the command.
D7 1 D6 LBA D5 1 D4 DRV# D3 HS3/LBA27 D2 HS2/LBA26 D1 HS1/LBA25 D0 HSO/LBA24
1: LBA (logical block address) mode 0: CHS address mode DRV#: card number 0: drive 0 is selected 1: drive 1 is selected If the value of the Drive# bit of the socket copy register matches the value of this bit, this controller will execute the command.
LBA:
21/33
Semiconductor 6.6.9 Status Register & Alternate Status Register (Read Only)
ML54051
This register indicates the internal status of the controller. When the host reads this register, the controller clears pending interrupt requests. However, even if the alternate status register is read, interrupts requests will not be cleared.
D7 BUSY D6 RDY D5 DWF D4 DSC D3 DRQ D2 CORR D1 IDX D0 ERR
BUSY:
RDY: DWF:
DSC: DRQ: CORR: IDX: ERR:
This bit is set in the following cases: * from the time when the host writes a command to the command register until processing of the command is completed * when hardware and software resets have been executed from the host This bit indicates Drive Ready. This bit is set when an error related to substitute processing occurs during access to the internal flash memory. If this bit is set, commands that follow may not execute properly. This bit is always set to 1. During execution of a command that involves data transfer, this bit is set once the transfer preparations are made. This bit indicates that a correctable error has occurred during access to flash memory. This bit is always set to 0. This bit is set when an error occurs during command execution. Detailed information is set in the error register.
6.6.10 Device Control Register (Write Only) This register is used to control interrupt requests from the card and to specify software reset.
D7 D6 X D5 D4 D3 1 D2 SRST D1 -IEN D0 0
SRST: -IEN:
While this bit is 1, the controller is in the reset state. 1: Interrupt signal mask, 0: Interrupt signal non-mask
6.6.11
Command Register (Write Only)
This register is used to set the command code.
D7 D6 D5 D4 D3 D2 D1 D0
Command Code
22/33
Semiconductor
ML54051
7. PCMCIA INTERFACE
7.1 ATA Commands (Standard) Supported ATA commands are listed below.
Command Check Power Mode Execute Drive Diagnostic Format Track Identify Drive Idle Idle Immediate Initialize Drive Parameters Read Buffer Read Long Sector Read Multiple Read Sector (s) Read Verify Sector (s) Recalibrate Seek Set Features Set Multiple Mode Set Sleep Mode Standby Standby Immediate Write Buffer Write Long Sector Write Multiple Write Sector (s) Code 98h, E5h 90h 50h ECh 97h, E3h 95h, E1h 91h E4h 22h, 23h C4h 20h, 21h 40h, 41h 1xh 7xh EFh C6h 99h, E6h 96h, E2h 94h, E0h E8h 32h, 33h C5h 30h, 31h -- -- -- -- -- -- -- -- -- -- -- -- -- FR -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- SC -- -- SN -- -- -- -- -- -- -- -- -- -- -- -- -- CY -- -- DH C/R/W C C W R C C C R R R R C C C C C C C C W W W W
FR: Features register SC: Sector count register CY: Cylinder register DH: Drive/head register C/R/W: C - Control, R - Read, W - Write : modified, valid -- : invalid
SN: Sector number register
23/33
Semiconductor 7.2 Commands for CompactFlash Supported CompactFlash commands are listed below.
Command Request Sense Erase Sector (s) Translate Sector Wear Level Write Multiple w/o Erase Write Sector (s) w/o Erase Code 03h C0h 87h F5h CDh 38h FR -- -- -- -- -- -- -- -- -- SC -- SN -- CY -- DH
ML54051
C/R/W C C R C W W
7.3 Vendor-Unique Commands Vendor-unique commands can be executed by writing "FFh" data to the command register when a value from the below chart has been written to the feature register.
Command Low Level Format Change Information Change Physical Cylinder Read All Un Lock Code FFh FFh FFh FFh FFh FR Description C/R/W C W C R C
Undefined Initialization of substitute information, all sectors Undefined Change CIS/Identify information Undefined Set maximum value of physical cylinder Undefined Read 528 bytes of the specified page Undefined Vendor-unique commands that follow are valid
Change Physical Cylinder: Sets the maximum value of the user area that is accessible from the host. For details, refer to section 7.6, "Number of Installed Memory Chips and CHS Structure."
7.4 Card Information Structure The desired card information structure (CIS) can be stored by the change information command. 7.5 Identify Information The desired identify information can be stored by the change information command.
24/33
Semiconductor 7.6 Number of Installed Memory Chips and CHS Structure
ML54051
NAND flash memory is erased in block units. Since block erasing is also performed during a 1page (sector) write, efficiency is increased during write operations by serially addressing sectors within the same block. The CHS structure and number of installed memory chips when using 64, 128, 256 and 512 Mbit memory are listed below (where C is the default value). The C value of the CHS address can be set by the change physical cylinder command (a vendor-unique command). * 64 Mbit Memory
Capacity 8 16 32 48 64 80 96 112 128 144 160 No. of Chips 1 2 4 6 8 10 12 14 16 18 20 CHS C 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 H 1 1 2 3 4 5 6 7 8 9 10 S 16 32 32 32 32 32 32 32 32 32 32 LBA Max. (Hex) 16000 (3E80) 32000 (7D00) 64000 (FA00) 96000 (17700) 128000 (1F400) 160000 (27100) 192000 (2EE00) 224000 (36B00) 256000 (3E800) 288000 (46500) 320000 (4E200)
* 128 Mbit Memory
Capacity 16 32 64 96 128 160 192 224 256 288 320 No. of Chips 1 2 4 6 8 10 12 14 16 18 20 CHS C 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 H 1 1 2 3 4 5 6 7 8 9 10 S 32 64 64 64 64 64 64 64 64 64 64 LBA Max. (Hex) 32000 (7D00) 64000 (FA00) 128000 (1F400) 192000 (2EE00) 256000 (3E800) 320000 (4E200) 384000 (5DC00) 448000 (6D600) 512000 (7D000) 576000 (8CA00) 640000 (9C400)
25/33
Semiconductor * 256 Mbit Memory
Capacity 32 64 128 192 256 320 384 448 512 576 640 No. of Chips 1 2 4 6 8 10 12 14 16 18 20 CHS C 1000 1000 1000 1000 1000 1000 1000 1000 1000 -- -- H 2 2 4 6 8 10 12 14 16 -- -- S 32 64 64 64 64 64 64 64 64 -- --
ML54051
LBA Max. (Hex) 64000 (FA00) 128000 (1F400) 256000 (3E800) 384000 (5DC00) 512000 (7D000) 640000 (9C400) 768000 (BB800) 896000 (DAC00) 1024000 (FA000) 1152000 (119400) 1280000 (138800)
* 512 Mbit Memory
Capacity 64 128 256 384 512 640 768 896 1024 1152 1280 No. of Chips 1 2 4 6 8 10 12 14 16 18 20 CHS C 1000 1000 1000 1000 1000 -- -- -- -- -- -- H 4 4 8 12 16 -- -- -- -- -- -- S 32 64 64 64 64 -- -- -- -- -- -- LBA Max. (Hex) 128000 (1F400) 256000 (3E800) 512000 (7D000) 768000 (BB800) 1024000 (FA000) 1280000 (138800) 1536000 (177000) 1792000 (1B5800) 2048000 (1F4000) 2304000 (232800) 2560000 (271000)
26/33
Semiconductor 7.7 Modes 7.7.1 Memory Mapped
ML54051
In the memory mapped mode, ATA registers appear in the 0 to 2K window of common memory space. 7.7.2 I/O Mapped 16 Contiguous Registers
In the I/O mapped 16 contiguous registers mode, contiguous ATA registers appear in I/O space. 7.7.3 Primary I/O Mapped
In the primary I/O mapped mode, ATA registers appear in 1F0h to 1F7h and 3F6h to 3F7h of the standard I/O address space. 7.7.4 Secondary I/O Mapped
In the secondary I/O mapped mode, ATA registers appear in 170h to 177h and 376h to 377h of the standard I/O address space. 7.7.5 True IDE
This mode is compatible with True IDE Mode.
27/33
Semiconductor
ML54051
8. CHIP MODES
8.1 Types There are four types of chip modes. Note that default pin assignments change depending upon the chip mode. * Normal Mode This mode is normally used. * External ROM Connection Mode This mode is used for connection to external ROM. * External CPU Connection Mode This mode is used for debugging. When this mode is activated, the internal microcontroller does not operate. * Test Mode This mode is used for testing. The test mode is not normally used. 8.2 Settings Chip modes are determined by the status of pcfg[1:0] when the power-on-reset signal (porn signal) rises.
pcfg [1 : 0] = 11 pcfg [1 : 0] = 01 pcfg [1 : 0] = 10 pcfg [1 : 0] = 00 Normal Mode External CPU Connection Mode External ROM Connection Mode Test Mode
8.3 Pin Assignment
Interface Extended Bus Extended Bus Extended Bus Extended Bus Extended Bus Host NAND Flash NAND Flash NAND Flash Signal Name xah [15 : 8] xad [7 : 0] xrd xwr xale hcseln xpsenn xrst xclk Normal (Low-Level) (Low-Level) (Low-Level) (Low-Level) (Low-Level) hcseln mctl mcen [7] mcen [6] O O O O O I I O O
External ROM Connection External CPU Connection
xah [15 : 8] xad [7 : 0] xrd xwr xale hcseln mctl mcen [7] mcen [6]
I/O I/O O O O I I O O
xah [15 : 8] xad [7 : 0] xrd xwr xale xint xpsenn xrst xclk
I/O I/O I I I O I O O
28/33
Semiconductor
ML54051
9. ELECTRICAL CHARACTERISTICS
9.1 Absolute Maximum Ratings
Parameter Power Supply Voltage Input Voltage Output Voltage Input Current Normal Buffer 5 V Tolerant Buffer Normal Buffer 5 V Tolerant Buffer Normal Buffer 5 V Tolerant Buffer Symbol VDD VI Tj = 25C VO II Tstg The standard is VSS = 0 V Condition Rating -0.3 to +4.6 -0.3 to VDD + 0.3 -0.3 to +6.0 -0.3 to VDD + 0.3 -0.3 to +6.0 -10 to +10 -6 to +6 -65 to +150 mA C V Unit
Storage Temperature
9.2 Recommended Operating Conditions
Parameter Power Supply Voltage Operating Temperature Symbol VDD Tj Range 3.0 to 3.6 -40 to +85 Unit V C
9.3 DC Characteristics
Parameter High Level Input Voltage Low Level Input Voltage Schmitt Trigger Threshold Voltage Symbol VIH VIL Vt+ Vt- DVt High Level Output Voltage Low Level Output Voltage High Level Input Current Low Level Input Current VOH VOL IIH IIL IOZH Output Leakage Current Standby Power Supply Current IOZL IDDS
(VDD = 3.0 to 3.6 V, VSS = 0 V, Tj = -40 to +85C) Condition TTL normal input 5 V tolerant input -- -- -- Vt+ - Vt- IOH = -100 mA IOL = 2, 4, 8 mA IOH = -100 mA IOL = 2, 4, 8 mA VIH = VDD VIL = VSS (50 kW pull-up) VOL = VDD VOL = VSS (50 kW pull-up) Output open Rating Min. 2.0 2.0 -0.3 -- 0.7 0.4 VDD - 0.2 2.4 -- -- -- -1 -170 -- -1 -170 -10 Typ. -- -- -- 1.5 1.0 0.5 -- -- -- -- 0.01 +0.01 -66 0.01 -0.01 -66 -- Max. VDD + 0.3 5.5 +0.8 2.0 -- -- -- -- 0.2 0.4 1 -- -15 1 -- -15 +10 mA V Unit
Note 1 : Listed values are for a normal buffer and a 5 V tolerant buffer unless otherwise specified. Note 2 : Typical values are indicated for a typical condition at VDD = 3.3 V and Tj = 25C. 29/33
Semiconductor
ML54051
10. BUS SPECIFICATIONS
10.1 I/O Mode The I/O mode conforms to PCMCIA-ATA and IDE specifications. 10.2 Bus Timing Specifications Bus timing conforms to PCMCIA-ATA, IDE and NAND flash memory specifications. 10.3 Power ON/OFF, Reset, Busy Timing
Parameter Symbol Condition 0 V VCC < 2.0 V -CE Signal Level Reset Setup Time Ready Release Delay Time -CE Recovery Time VCC Rise Time VCC Fall Time Reset Width VI (CE) tsu (RESET) td (BSY) trec (VCC) tpr tpf tw (RESET) th (Hi-Z RESET) ts (Hi-Z RESET) 2.0 V VCC < VIH VIH VCC -- -- -- 10%AE(VCC + 5%) 90% *1 (VCC - 5%) 90%AE10% *1 -- -- -- Specified Value Min. 0 VCC - 0.1 VIH TBD TBD TBD TBD TBD TBD TBD TBD Max. VI Max. VI Max. VI Max. ms ms ms ms ms ms ms ms V Unit
*1:
tpr and tpf are defined as the time of the "straight-line change from 10% to 90% of V CC", and vice-versa. Even if the rise and fall waveforms are non-linear, the maximum slope of the waveform must meet these specifications.
tpr tsu(RESET) VIH tsu(CE)
,
VCC -CE1, -CE2 RESET th(Hi-Z RESET) Hi-Z +RDY/-BSY VCC trec(VCC) -CE1, -CE2 RESET ts(Hi-Z RESET)
2V
td(BSY)
tw(RESET)
tpf
VIH 2V Hi-Z
30/33
Semiconductor
ML54051
11. PACKAGE DIMENSIONS
(Unit : mm)
LQFP144-P-2020-0.50-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.37 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 31/33
Semiconductor
ML54051
12. APPLICATION EXAMPLES
Stand-Alone Chip
Connecter VCC 5 to 3 Cnv
ML54051 A0-10 Address ha0-10 D0-15 -CE1 -CE2 -OE -WE RDY/-BSY/-IREQ WP/-IOIS16 -IORD -IOWR RST -WAIT -INPACK -REG SPKR -STSCHG A25 -CD1 -CD2 GND Data hd0-15 hcen1 hcen2 hoen hwen hirqn hiois16n hiordn hiowrn hrst hwaitn hinpackn hregn hspkr hstschgn hcseln
SRAM
ra0-16 Address A0-16 rd0-7 rren rwen rcen maio0-7 maren mawen marbn macle maale I/O1-8 -RE -WE R/-B CLE 1 ALE -WP -CE mbio0-7 Address/Data I/O1-8 -RE -WE R/-B CLE 3 ALE -WP -CE I/O1-8 -RE -WE R/-B CLE ALE 15 -WP -CE Data D0-7 -OE -WE -CE Address/Data
*****
Vlt Dct
porn
mbren mbwen mbrbn mbcle mbale I/O1-8 -RE -WE R/-B CLE 2 ALE -WP -CE mwpn mcen0 mcen1 mcen2 mcen3 mcen4 mcen5 mcen6 mcen7 I/O1-8 -RE -WE R/-B CLE 4 ALE -WP -CE I/O1-8 -RE -WE R/-B CLE 16 ALE -WP -CE
xin 20 MHz xout
*****
mctl txd rxd
32/33
Semiconductor Chip and External Decoder Circuit
ML54051
Connecter VCC 5 to 3 Cnv
ML54051 A0-10 Address ha0-10 D0-15 -CE1 -CE2 -OE -WE RDY/-BSY/-IREQ WP/-IOIS16 -IORD -IOWR RST -WAIT -INPACK -REG SPKR -STSCHG A25 -CD1 -CD2 GND Data hd0-15 hcen1 hcen2 hoen hwen hirqn hiois16n hiordn hiowrn hrst hwaitn hinpackn hregn hspkr hstschgn hcseln
SRAM
ra0-16 Address A0-16 rd0-7 rren rwen rcen maio0-7 maren mawen marbn macle maale I/O1-8 -RE -WE R/-B CLE 1 ALE -WP -CE mbio0-7 Address/Data I/O1-8 -RE -WE R/-B CLE 3 ALE -WP -CE I/O1-8 -RE -WE R/-B CLE ALE 63 -WP -CE Data D0-7 -OE -WE -CE Address/Data
*****
Vlt Dct
porn
mbren mbwen mbrbn mbcle mbale I/O1-8 -RE -WE R/-B CLE 2 ALE -WP -CE mwpn mcen0 mcen1 mcen2 mcen3 mcen4 mcen5 mcen6 mcen7 Decorder en out0 in0 out1 in1 out2 in2 in3 in4 out30 out31 I/O1-8 -RE -WE R/-B CLE 4 ALE -WP -CE I/O1-8 -RE -WE R/-B CLE 64 ALE -WP -CE
xin 20 MHz xout
*****
mctl txd rxd
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